ATLANTA Standard Smart Card Our standard

Standard Smart Card
Our standard smart card and smart card modules consist of family of secured memory chips, non-secured I2C memory chips, microprocessor chips and microcontroller chips. The finished products can be in smartcard modules , white card or full colour printed card to suite our customers requirement.

Contactless Smart Card
We provide industrial standard contactless smart card for various applications.

Single and Multi-Chip Module Manufacturing Services

With complete chip module manufacturing facilities, we are offering highly cost effective, high quality chip module manufacturing services. Our process capabilities include wafer sawing, die bonding, wire bonding, encapsulation and module testing. We are specialize in high volume chip module manufacturing and custom designed chip module manufacturing. Our chip module manufacturing services are:

Single and multi-chip module manufacturing
Packaging of customer consigned chips or contract manufacturing
Design and manufacturing of custom layout or special wire bonding chip modules
Film tape layout design
Chip module prototype development

Single and Multi-Chip Card Manufacturing Services
With complete automated card embedding facilities and in-depth know how on module characteristics, we are offering highly cost effective and high quality card embedding services. Our chip card manufacturing services are:

Standard chip card embedding
Card embedding services for customer consigned cards
Card embedding services for customer consigned die/module and/or card.

WAFER SAWINGS
DICING SERVICE FOR WAFERS

Materials

Aluminium oxide
Aluminium nitride
Ceramics
Glass
Silicon
Other material on request

Wafer dimensions

max. 6 inch

Wafer thickness

min. 190 µm
max. 400 µm

Dicing channel

silicon: min. 75 µm
other: min. 100 µm

Tape

standard blue tape

Delivery form

on tape with 6 inch frame

REMARKS
The dicing channel should be free of metallisation. It is not possible to saw the wafer in proper form if electroplated metallization with a thickness above 1 µm exists in the dicing channel.

Please email us for further information.